This tender is from the country of Malaysia in Asia region. The tender was published by UNIVERSITI TEKNIKAL MALAYSIA MELAKA on 07 Nov 2022 for SUPPLY, DELIVERY, INSTALLATION, AND TESTING OF PCB DESIGN AND SIMULATION SOFTWARE (LEVEL 3) WITH DONGLES FOR THE LABORATORY OF THE FACULTY ELECTRONIC ENGINEERING AND COMPUTER ENGINEERING, UNIVERSITI TEKNIKAL MALAYSIA, MELAKA. The last date to submit your bid for this tender was 18 Nov 2022. This tender is for the companies specializing in Populated printed circuit boards, Pattern design software package and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
UNIVERSITI TEKNIKAL MALAYSIA MELAKA
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
31712310 : Populated printed circuit boards
48941000 : Pattern design software package
Tender Document Type:
Notice Type
Tender Description:
SUPPLY, DELIVERY, INSTALLATION, AND TESTING OF PCB DESIGN AND SIMULATION SOFTWARE (LEVEL 3) WITH DONGLES FOR THE LABORATORY OF THE FACULTY ELECTRONIC ENGINEERING AND COMPUTER ENGINEERING, UNIVERSITI TEKNIKAL MALAYSIA, MELAKA
Tender Bidding Type:
Tender Notice No:
Tender Document:
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