Germany Microelectronic machinery and apparatus High Precision bonder for wafer and chiplet level assembly IZM-01 - PR915599-2590-P
This tender is from the country of Germany in Europe region. The tender was published by Fraunhofer-Gesellschaft - Einkauf B12 on 10 Apr 2025 for Germany Microelectronic machinery and apparatus High Precision bonder for wafer and chiplet level assembly IZM-01 - PR915599-2590-P. The last date to submit your bid for this tender was 12 May 2025. This tender is for the companies specializing in Microelectronic machinery and apparatus and microsystems and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
Fraunhofer-Gesellschaft - Einkauf B12
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
31712000 : Microelectronic machinery and apparatus and microsystems
Tender Document Type:
Tender Notice
Tender Description:
Germany Microelectronic machinery and apparatus High Precision bonder for wafer and chiplet level assembly IZM-01 - PR915599-2590-P
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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