This tender is from the country of Germany in Europe region. The tender was published by Fraunhofer-Gesellschaft to promote applied research e v on 16 Jul 2025 for Thermo reflectance microscope imws-01 1 - pr1017819-2690-p The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the operational behavior reliability security and lifespan of innovative materials in components and systems The business area Electronic Materials and Components of the Fraunhofer IMWS supports partners from industry and science with its internationally recognized expertise in the error analysis of electronic components The Fraunhofer IMWS will expand its skills for the advanced error analysis and material characterization in order to support the introduction of new heterogeneous integration technologies that face the challenges of manufacturing and reliability The workflow in the error analysis begins with the precise and reliable localization of error -related deviations that are required for error localization With increasing degrees of integration however functionality and increase in performance lead to decreasing feature dimensions to extend into the third spatial area and thus to a significant increase in total complexity The error localization for microelectronic high-end components and systems must offer high sensitivity for different contrast mechanisms in combination with microscopic sensitivity and resolution While defects in electronic circuits can go hand in hand with structural changes and can therefore be passively inspected defective abnormal emissions open up the possibility of identifying and localizing the incorrect area or structure Electrical defects can be accompanied by the emission of photons in a wide spectral band In this sense thermal emissions have the greatest potential because they can spread through opaque materials and enable detection by sufficiently sensitive detection methods In this context thermal reflection microscopy is a powerful technology since the use of test wavelengths in the optical area for analyzing temperature -related reflectivity changes is used on the sample surface While defects in electronic circuits can go hand in hand with structural changes and can therefore be passively inspected defective abnormal emissions open up the possibility of identifying and localizing the incorrect area or structure Electrical defects can be accompanied by the emission of photons in a wide spectral band In this sense thermal emissions have the greatest potential because they can spread through opaque materials and enable detection by sufficiently sensitive detection methods Options 1 1 5 General device specifications The system should include the following thermal characterization procedures - The software must enable the quantitative extraction of local thermal properties e g thermal conductivity diffusiveness interface resistance from measured transients 1 1 6 General device specifications The system should include the following thermal characterization techniques - Ability to make absolute temperature measurements 1 1 7 General device specifications The system should include the following thermal characterization techniques - Measurement and analysis of the transient heat spread 1 2 4 Microscope configuration and tables The motorized table should be one - Incremental triggering in the event of movement in X - Enable ROI scanning with trigger output for X and Y increment 1 2 6 1 2 6 Microscope configuration and tables The device should contain a vibration -insulated platform or be mounted on it which is suitable for high -precision microscopic measurements 1 2 8 Microscope configuration and levels The device should optionally enable the testing of up to 8-inch wafers 1 3 3 1 3 3 Optical paths and measurement Pump and probe rays should be arranged in such a way that the probe point can be moved relative to the pump spot which enables an analysis of the lateral heat spread 1 3 6 Optical paths and measurement This microscope should also have the following features - a revolver head that can absorb lenses with different enlargement 1 3 8 Optical paths and measurement Vollfeld-Thermoref. The last date to submit your bid for this tender was 12 Aug 2025. This tender is for the companies specializing in Microscopes and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
Fraunhofer-Gesellschaft to promote applied research e v
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
38510000 : Microscopes
Tender Document Type:
Tender Notice
Tender Description:
Thermo reflectance microscope imws-01 1 - pr1017819-2690-p The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the operational behavior reliability security and lifespan of innovative materials in components and systems The business area Electronic Materials and Components of the Fraunhofer IMWS supports partners from industry and science with its internationally recognized expertise in the error analysis of electronic components The Fraunhofer IMWS will expand its skills for the advanced error analysis and material characterization in order to support the introduction of new heterogeneous integration technologies that face the challenges of manufacturing and reliability The workflow in the error analysis begins with the precise and reliable localization of error -related deviations that are required for error localization With increasing degrees of integration however functionality and increase in performance lead to decreasing feature dimensions to extend into the third spatial area and thus to a significant increase in total complexity The error localization for microelectronic high-end components and systems must offer high sensitivity for different contrast mechanisms in combination with microscopic sensitivity and resolution While defects in electronic circuits can go hand in hand with structural changes and can therefore be passively inspected defective abnormal emissions open up the possibility of identifying and localizing the incorrect area or structure Electrical defects can be accompanied by the emission of photons in a wide spectral band In this sense thermal emissions have the greatest potential because they can spread through opaque materials and enable detection by sufficiently sensitive detection methods In this context thermal reflection microscopy is a powerful technology since the use of test wavelengths in the optical area for analyzing temperature -related reflectivity changes is used on the sample surface While defects in electronic circuits can go hand in hand with structural changes and can therefore be passively inspected defective abnormal emissions open up the possibility of identifying and localizing the incorrect area or structure Electrical defects can be accompanied by the emission of photons in a wide spectral band In this sense thermal emissions have the greatest potential because they can spread through opaque materials and enable detection by sufficiently sensitive detection methods Options 1 1 5 General device specifications The system should include the following thermal characterization procedures - The software must enable the quantitative extraction of local thermal properties e g thermal conductivity diffusiveness interface resistance from measured transients 1 1 6 General device specifications The system should include the following thermal characterization techniques - Ability to make absolute temperature measurements 1 1 7 General device specifications The system should include the following thermal characterization techniques - Measurement and analysis of the transient heat spread 1 2 4 Microscope configuration and tables The motorized table should be one - Incremental triggering in the event of movement in X - Enable ROI scanning with trigger output for X and Y increment 1 2 6 1 2 6 Microscope configuration and tables The device should contain a vibration -insulated platform or be mounted on it which is suitable for high -precision microscopic measurements 1 2 8 Microscope configuration and levels The device should optionally enable the testing of up to 8-inch wafers 1 3 3 1 3 3 Optical paths and measurement Pump and probe rays should be arranged in such a way that the probe point can be moved relative to the pump spot which enables an analysis of the lateral heat spread 1 3 6 Optical paths and measurement This microscope should also have the following features - a revolver head that can absorb lenses with different enlargement 1 3 8 Optical paths and measurement Vollfeld-Thermoref
Tender Bidding Type:
Tender Notice No:
Tender Document:
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