This tender is from the country of Ireland in Europe region. The tender was published by University College Cork on 22 Sep 2021 for Purchase equipment to package optical components, specifically optical fibre and micro-optical components to photonic devices such as Photonic Integrated Circuits (PICs). These PIC devices include Silicon (Si), Indium Phosphide (InP) and Silicon Nitride (SiN) type photonic devices. The last date to submit your bid for this tender was 13 Oct 2021. This tender is for the companies specializing in Microelectronic machinery and apparatus and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
University College Cork
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
31712100 : Microelectronic machinery and apparatus
Tender Document Type:
Tender Notice
Tender Description:
Purchase equipment to package optical components, specifically optical fibre and micro-optical components to photonic devices such as Photonic Integrated Circuits (PICs). These PIC devices include Silicon (Si), Indium Phosphide (InP) and Silicon Nitride (SiN) type photonic devices
Tender Bidding Type:
Tender Notice No:
Tender Document:
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