Small Chip Die Bonder
This tender is from the country of Korea in Asian region. The tender was published by Chungbuk Techno Park Foundation on 30 Oct 2025 for Small Chip Die Bonder. The last date to submit your bid for this tender was 11 Nov 2025. This tender is for the companies specializing in Cling film, Die-stamping machines, Soldering materials and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
Chungbuk Techno Park Foundation
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
32354800 : Cling film
42635000 : Die-stamping machines
44315310 : Soldering materials
Tender Document Type:
Tender Notice
Tender Description:
Small Chip Die Bonder
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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