Purchasing A Software Package For Integrated Circuit Design Training At Ulsan Institute Of Science And Technology Ulsan Institute Of Science And Technology

This tender is from the country of South Korea in East Asia region. The tender was published by ULSAN INSTITUTE OF SCIENCE AND TECHNOLOGY on 11 Nov 2022 for Purchasing A Software Package For Integrated Circuit Design Training At Ulsan Institute Of Science And Technology Ulsan Institute Of Science And Technology. The last date to submit your bid for this tender was 15 Nov 2022. This tender is for the companies specializing in Integrated circuit lids, Industry specific software package, Bridge software package, software package suites and similar sectors.

*The deadline for this tender has passed.

Tender Organisation:

ULSAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Tender Sector:

Tender Service:

Worldwide

Tender Region:

Tender Country:

Tender CPV:

31712119 : Integrated circuit lids
48100000 : Industry specific software package
48219800 : Bridge software package
48422000 : software package suites

Tender Document Type:

Notice Type

Tender Description:

Purchasing A Software Package For Integrated Circuit Design Training At Ulsan Institute Of Science And Technology Ulsan Institute Of Science And Technology

Tender Bidding Type:

Publish Date: 11 Nov 2022

Deadline Date: 15 Nov 2022

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  • More than 15 days to go

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