Wafer silicon substrate and glass thermal image identification and sorting labor entrustment
This tender is from the country of Taiwan in Asian region. The tender was published by Nuclear Energy Research Institute, Atomic Energy Commission, Executive Yuan on 08 Sep 2022 for Wafer silicon substrate and glass thermal image identification and sorting labor entrustment. The last date to submit your bid for this tender was 13 Sep 2022. This tender is for the companies specializing in Thermal Camera and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
Nuclear Energy Research Institute, Atomic Energy Commission, Executive Yuan
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
38651700 : Thermal Camera
Tender Document Type:
Tender notices
Tender Description:
Wafer silicon substrate and glass thermal image identification and sorting labor entrustment
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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