Rf probe station emft-06 3 - pr1004509-2270-p
This tender is from the country of Germany in Europe region. The tender was published by Fraunhofer Society - Purchasing B12 on 10 Dec 2025 for Rf probe station emft-06 3 - pr1004509-2270-p 1 piece For the previously generally described measuring station an automated sample station is purchased in order to carry out these measurements on chips wafers and sample holders for material tests The sample station must generally be suitable for mmWave and SubTHz frequency probes The key requirements are that the sample station can carry at least four frequency extenders allowing true differential device characterization on a 2-port device without reconnection In addition a microscope system suitable for mmWave and SubTHz measurements on chip and wafer is required as well as a camera The chuck of the wafer prober should allow theta rotation and movement in the z direction In addition a thermal chuck system required that ensures temperatures from -40 C to 200 C on the device under test In general the wafer prober should provide automatic control of the probing process and control software with a user interface. The last date to submit your bid for this tender is 13 Jan 2026. This tender is for the companies specializing in IT services and similar sectors.
Tender Organisation:
Fraunhofer Society - Purchasing B12
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
72000000 : IT services: consulting, software development, Internet and support
Tender Document Type:
Tender Notice
Tender Description:
Rf probe station emft-06 3 - pr1004509-2270-p 1 piece For the previously generally described measuring station an automated sample station is purchased in order to carry out these measurements on chips wafers and sample holders for material tests The sample station must generally be suitable for mmWave and SubTHz frequency probes The key requirements are that the sample station can carry at least four frequency extenders allowing true differential device characterization on a 2-port device without reconnection In addition a microscope system suitable for mmWave and SubTHz measurements on chip and wafer is required as well as a camera The chuck of the wafer prober should allow theta rotation and movement in the z direction In addition a thermal chuck system required that ensures temperatures from -40 C to 200 C on the device under test In general the wafer prober should provide automatic control of the probing process and control software with a user interface
Tender Bidding Type:
Tender Notice No:
Tender Document:
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- 15 Days to go
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