Test wafers and double-sided polished silicon wafers for micronanotechnology center
This tender is from the country of Switzerland in Europe region. The tender was published by Epfl-scientific equipment on 23 Dec 2025 for Test wafers and double-sided polished silicon wafers for micronanotechnology center. The last date to submit your bid for this tender is 02 Feb 2026. This tender is for the companies specializing in Microfiche equipment, Microform equipment and similar sectors.
Tender Organisation:
Epfl-scientific equipment
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
38654200 : Microfiche equipment
38654300 : Microform equipment
Tender Document Type:
Tender Notice
Tender Description:
Test wafers and double-sided polished silicon wafers for micronanotechnology center
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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