Announcement of Winning Bid for Optoelectronic Integrated Chip Multi-Dimensional Performance Testing System of University of Science and Technology Beijing
This tender is from the country of China in Asian region. The tender was published by Huacai Tendering Group Co., Ltd. on 12 Dec 2025 for Announcement of Winning Bid for Optoelectronic Integrated Chip Multi-Dimensional Performance Testing System of University of Science and Technology Beijing. The last date to submit your bid for this tender is 01 Jan 2026. This tender is for the companies specializing in Electronic integrated circuits and microassemblies, Computer hardware acceptance testing consultancy services, Test and Evaluation of military electronic systems and similar sectors.
Tender Organisation:
Huacai Tendering Group Co., Ltd.
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
31712110 : Electronic integrated circuits and microassemblies
72140000 : Computer hardware acceptance testing consultancy services
73436000 : Test and Evaluation of military electronic systems
Tender Document Type:
Tender Notice
Tender Description:
Announcement of Winning Bid for Optoelectronic Integrated Chip Multi-Dimensional Performance Testing System of University of Science and Technology Beijing
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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