Procurement of 0722-264YDZB09ZB2 01 8-inch Taiko Wafer Thinning Machine 2
This tender is from the country of China in Asian region. The tender was published by China Far East International Tendering Co LTD on 02 Mar 2026 for Procurement of 0722-264YDZB09ZB2 01 8-inch Taiko Wafer Thinning Machine 2. The last date to submit your bid for this tender is 23 Mar 2026. This tender is for the companies specializing in Microelectronic machinery and apparatus, Machine tools operated by laser and machining centres and similar sectors.
Tender Organisation:
China Far East International Tendering Co LTD
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
31712100 : Microelectronic machinery and apparatus
42610000 : Machine tools operated by laser and machining centres
Tender Document Type:
Tender Notice
Tender Description:
Procurement of 0722-264YDZB09ZB2 01 8-inch Taiko Wafer Thinning Machine 2
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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