This tender is from the country of China in Asian region. The tender was published by Shandong Deloitte Tendering Assessment Cost Consulting Co., Ltd. on 05 Nov 2025 for Shandong University chip packaging and testing service bidding and procurement public bidding announcement. The last date to submit your bid for this tender was 25 Nov 2025. This tender is for the companies specializing in Integrated circuit packages, Computer hardware acceptance testing consultancy services, Packaging and related services and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
Shandong Deloitte Tendering Assessment Cost Consulting Co., Ltd.
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
31712117 : Integrated circuit packages
72140000 : Computer hardware acceptance testing consultancy services
79920000 : Packaging and related services
Tender Document Type:
Tender Notice
Tender Description:
Shandong University chip packaging and testing service bidding and procurement public bidding announcement
Tender Bidding Type:
Tender Notice No:
Tender Document:
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