ULTRA DEEP SUB-MICRON INTERFACE AND SYSTEM-IN-PACKAGE TECHNOLOGY - RE-ISSUE - 9829479

Common Questions About This Tender

• Who has issued this tender, and what is it for?

  The tender has been issued by EUROPEAN SPACE AGENCY ESA in France. Such a type of tender falls under Electronic integrated circuits and microassemblies, Integrated circuit packages, Micro-channel architecture, within the Night Vision Devices Tenders sector, and is listed on Tender Impulse under notice number 1-12868.

• What are the key dates for this tender?

  The notice was published on 21 Oct 2025 and submissions close on 28 Nov 2025. Late bids are rarely accepted in public procurement, so aim to have your documents ready several days before the closing date.

• Which CPV codes apply to this tender?

  It is classified under CPV codes 31712110, 31712117, 48628000, which correspond to Electronic integrated circuits and microassemblies, Integrated circuit packages, Micro-channel architecture. If your company supplies these products or services, these are the codes to save in your alert profile so no matching tender passes you by.

• Can I submit my bid for this tender to Tender Impulse?

  No - and this matters. Tender Impulse is a tender aggregation and alert service: we collect procurement notices from official sources around the world and list them in one place. We do not receive, forward or evaluate bids. Your bid for this tender must be submitted directly to EUROPEAN SPACE AGENCY ESA, using the method described in the original tender document, before 28 Nov 2025. Tender Impulse provides complete assistance in submitting all bids posted on its website.

• How do I get the bid documents and participation details?

  Request a live demo on Tender Impulse and our tender experts will walk you through this listing, share the available documents, and explain how to submit your bid to EUROPEAN SPACE AGENCY ESA. Subscribers also receive help with registration requirements and, where needed, translation of non-English notices - but the submission itself always goes from you to the buyer.

• How can I find more tenders like this in France?

  There are currently 12098 live tenders of 294671 total tenders from France on Tender Impulse. You can browse them on our France tenders page, or save a search combining France with CPV codes {full_cpv_codes} - we will then email you every new match on the day it is published.

• How to prepare for this bid?

  Suppliers must verify technical specifications, the delivery schedules and any other intrinsic details as provided in the complete bid documents before deciding to submit their bids. All necessary certifications and supplier registrations must be undertaken before participation.

• Is this tender beneficial for me?

  The procurement is applicable to companies in the Electronic integrated circuits and microassemblies, Integrated circuit packages, Micro-channel architecture and related industries. If you belong to this industry, you can review the technical documents before assessing your relevance to your company.

• What is the Procurement trend for ULTRA DEEP SUB-MICRON INTERFACE AND SYSTEM-IN-PACKAGE TECHNOLOGY - RE-ISSUE?

  The public procurement trends for ULTRA DEEP SUB-MICRON INTERFACE AND SYSTEM-IN-PACKAGE TECHNOLOGY - RE-ISSUE can be assessed by viewing historical data and buying patterns for this product. Subscribed members can view and even download reports of tenders released in the past for their market research. This shall allow them to carefully prepare a compelling bid.