Framework agreement for hosted chip design platform with chip production
This tender is from the country of Germany in Europe region. The tender was published by Barkhausen Institut gGmbH on 09 Jun 2025 for Framework agreement for hosted chip design platform with chip production. The last date to submit your bid for this tender was 07 Jul 2025. This tender is for the companies specializing in Hardware consultancy services, Platform interconnectivity software development services, Hardware integration consultancy services and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
Barkhausen Institut gGmbH
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
72100000 : Hardware consultancy services
72212211 : Platform interconnectivity software development services
72228000 : Hardware integration consultancy services
Tender Document Type:
Tender Notice
Tender Description:
Framework agreement for hosted chip design platform with chip production
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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