The Barkhausen Institut gGmbH in Germany from Europe region had released this tender for Framework agreement for hosted chip design platform with chip production with tender notice no. VB B01_25 published on 09 Jun 2025. The tender expired on 07 Jul 2025. This tender is sourced from Vergabe and is eligible for suppliers interested in Hardware consultancy services, Platform interconnectivity software development services, Hardware integration consultancy services. Interested bidders can obtain further information including complete bid documents or ways to participate by registering on Tender Impulse and referencing via Tender Impulse ID 8247193.
*The deadline for this tender has passed.
Tender Notice No:
VB B01_25
Tender Organisation:
Barkhausen Institut gGmbH
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
72100000 : Hardware consultancy services
72212211 : Platform interconnectivity software development services
72228000 : Hardware integration consultancy services
Tender Source:
Vergabe
Tender Document Type:
Tender Notice
Tender Description:
Framework agreement for hosted chip design platform with chip production
Tender Bidding Type:
Tender Document:
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