I-line-stepper-belichtungssystem iisb wp4 5 - pr840232-2790-p

Tender Organisation:

Fraunhofer Society - Purchasing B12

Tender Sector:

Education & Training Tenders

Tender Service:

Worldwide

Tender Region:

Europe

Tender Country:

Germany

Tender CPV:

37441200 : Stair climbers
79822400 : Lithographic services

Tender Document Type:

Tender Notice

Tender Description:

I-line-stepper-belichtungssystem iisb wp4 5 - pr840232-2790-p 1 piece i-line stepper exposure system IISB WP4 5 An independent i-line step exposure system is being sought This is used for structure transfer through selective exposure of UV light-sensitive photoresist systems through a reducing photomask The UV radiation should be generated by a mercury vapor lamp or an LED light source Options 2 7 Option to customize between front and back Please provide the achievable overlay accuracy between the front and back as well as information about the substrate conditions that enable or limit the match between the front and back e g material wafer thickness etc 2 9 LED as a light source or conversion of the mercury arc lamp to an LED light source within 10 years of delivery 3 3 Processing of 100 mm substrates with the substrate properties listed in 3 3 1 - 3 3 x The evaluation of the following points is based on the effort required to convert 150 and 200 mm processing standard material to 100 mm wafer processing The shorter the changeover times the better Please provide information about the average duration and effort required for the changeover 3 3 Processing of 100 mm substrates with the substrate properties listed in 3 3 1 - 3 3 x The evaluation of the following points is based on the effort required to convert 150 and 200 mm processing standard material to 100 mm wafer processing The shorter the changeover times the better Please provide information about the average duration and effort required for the changeover 3 3 1 Automatic handling including loading and unloading alignment including Flat Align automatic loading with pre-alignment of the wafers and Flat Align 3 10 m and processing first exposure and exposure with pre-alignment for 100 mm substrates with substrate thicknesses of 200-1650 m 25 m made of transparent semi-transparent or opaque materials such as glass silicon carbide and silicon 3 3 2 Handling and processing substrate materials not specifically listed in 3 1 to 3 3 1 e g glass GaN Ge with substrate sizes and thicknesses and deformations in accordance with the specifications set out in 3 1 to 3 3 1 including automatic loading with pre-alignment of wafers and flat orientation 3 10 m The more substrate variants that can be processed the better Please indicate under which conditions these substrates can be reliably processed 3 3 3 Handling and processing of substrates not specifically listed in points 3 1 to 3 3 2 e g 125 mm wafers wafer fragments rectangular substrates etc including automatic loading with pre-alignment of wafers and flat orientation 3 10 m The evaluation is based on the effort and duration of the conversion process the shorter lower the better Please describe the work required and the average changeover time as well as the conditions under which these substrates can be reliably processed e g with a carrier system 3 Compatibility of the handling system with the following cassette models 100 mm substrates type number A72-39M-06 material Fluoroware PFA 6 1 1 GEM300 connection 6 2 3 The computer must be able to be integrated into the existing Windows AD domain 6 2 4 Remote access to monitor and remotely control the system 6 2 6 Offline version of the software for preparing exposure jobs

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Tender Document:

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