Project 691: “Extreme backside thinning of integrated circuits”
This tender is from the country of Germany in Europe region. The tender was published by Federal Office for Information Security on 29 Oct 2025 for Project 691: “Extreme backside thinning of integrated circuits”. The last date to submit your bid for this tender was 01 Dec 2025. This tender is for the companies specializing in Electronic integrated circuits and microassemblies, Integrated circuit packages, Transistor chips and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
Federal Office for Information Security
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
31712110 : Electronic integrated circuits and microassemblies
31712117 : Integrated circuit packages
31712354 : Transistor chips
Tender Document Type:
Tender Notice
Tender Description:
Project 691: “Extreme backside thinning of integrated circuits”
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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