Circuit Design of the Application Test Chip for Low-cost Die-to-Die Interface 1 Set
This tender is from the country of Japan in Asian region. The tender was published by National University Corporation on 13 Aug 2025 for Circuit Design of the Application Test Chip for Low-cost Die-to-Die Interface 1 Set. The last date to submit your bid for this tender was 27 Aug 2025. This tender is for the companies specializing in Network interfaces cards, Circuit testers, Integrated circuit packages and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
National University Corporation
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
30237135 : Network interfaces cards
31212200 : Circuit testers
31712117 : Integrated circuit packages
Tender Document Type:
Tender Notice
Tender Description:
Circuit Design of the Application Test Chip for Low-cost Die-to-Die Interface 1 Set
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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