Ultra-Precision Machining-Based Semiconductor 3D Inspection System 1 set
This tender is from the country of Japan in Asian region. The tender was published by RIKEN on 07 Jan 2026 for Ultra-Precision Machining-Based Semiconductor 3D Inspection System 1 set. The last date to submit your bid for this tender is 22 Jan 2026. This tender is for the companies specializing in Metallurgical microscopes, X-ray inspection equipment, Machines for inspecting the internal surface of pipelines and similar sectors.
Tender Organisation:
RIKEN
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
38513200 : Metallurgical microscopes
38582000 : X-ray inspection equipment
42997100 : Machines for inspecting the internal surface of pipelines
Tender Document Type:
Tender Notice
Tender Description:
Ultra-Precision Machining-Based Semiconductor 3D Inspection System 1 set
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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