Wafer transfer machine for 300mm wafer 1 set
This tender is from the country of Japan in Asian region. The tender was published by National Institute of Advanced Industrial Science and Technology on 29 Jan 2026 for Wafer transfer machine for 300mm wafer 1 set. The last date to submit your bid for this tender is 12 Feb 2026. This tender is for the companies specializing in Microelectronic machinery and apparatus and microsystems, Semiconductors and similar sectors.
Tender Organisation:
National Institute of Advanced Industrial Science and Technology
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
31712000 : Microelectronic machinery and apparatus and microsystems
31712330 : Semiconductors
Tender Document Type:
Tender Notice
Tender Description:
Wafer transfer machine for 300mm wafer 1 set
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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