Ejecting module design and AI-based alignment image correction technology development to improve ultra-thin die process quality - 13062554
This tender is from the country of Korea in Asian region. The tender was published by Korea Institute of Industrial Technology on 27 May 2026 for Ejecting module design and AI-based alignment image correction technology development to improve ultra-thin die process quality. The last date to submit your bid for this tender was 08 Jun 2026. This tender is for the companies specializing in Engineering design services, Engineering design services for industrial process and production, Image-processing software development services, Pattern design software development services and similar sectors. Tender Impulse ID: 13062554.
*The deadline for this tender has passed.
Tender Organisation:
Korea Institute of Industrial Technology
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
71320000 : Engineering design services
71323000 : Engineering design services for industrial process and production
72212328 : Image-processing software development services
72212941 : Pattern design software development services
Tender Document Type:
Tender Notice
Tender Description:
Ejecting module design and AI-based alignment image correction technology development to improve ultra-thin die process quality
Tender Bidding Type:
Tender Notice No:
Tender Document:
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- 15 Days to go
- More than 15 days to go
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