This tender is from the country of Korea in Asian region. The tender was published by Chungbuk Techno Park Foundation on 28 Oct 2025 for High precision flip chip bonder. The last date to submit your bid for this tender was 12 Nov 2025. This tender is for the companies specializing in Laboratory, optical and precision equipments (excl. glasses), IT services and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
Chungbuk Techno Park Foundation
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
38000000 : Laboratory, optical and precision equipments (excl. glasses)
72000000 : IT services: consulting, software development, Internet and support
Tender Document Type:
Tender Notice
Tender Description:
High precision flip chip bonder
Tender Bidding Type:
Tender Notice No:
Tender Document:
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