Production of CW laser bonding system for diamond power semiconductor package - 13625148
This tender with tender notice no. R26BK01611931 is from the country of Korea in Asian region, details sourced from G2b Korea. The tender was published by Korea Institute of Industrial Technology on 02 Jul 2026 for Production of CW laser bonding system for diamond power semiconductor package. The last date to submit your bid for this tender is 09 Jul 2026. This tender is for the companies specializing in Microelectronic machinery and apparatus and microsystems, Laser diodes, Industrial lasers and similar sectors. Tender Impulse ID: 13625148.
Tender Notice No:
R26BK01611931
Tender Organisation:
Korea Institute of Industrial Technology
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
31712000 : Microelectronic machinery and apparatus and microsystems
31712348 : Laser diodes
38636110 : Industrial lasers
Tender Source:
G2b Korea
Tender Document Type:
Tender Notice
Tender Description:
Production of CW laser bonding system for diamond power semiconductor package
Tender Bidding Type:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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