Purchase of dicing cutter from Semiconductor Specialization University Support Project Group
This tender is from the country of Korea in Asian region. The tender was published by National Geumoh Institute of Technology Industry-Academic Cooperation Foundation on 21 Oct 2025 for Purchase of dicing cutter from Semiconductor Specialization University Support Project Group. The last date to submit your bid for this tender was 11 Nov 2025. This tender is for the companies specializing in Wire-cutter and bistoury, Machine tools operated by laser and machining centres, Machining centre and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
National Geumoh Institute of Technology Industry-Academic Cooperation Foundation
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
33141410 : Wire-cutter and bistoury
42610000 : Machine tools operated by laser and machining centres
42612000 : Machining centre
Tender Document Type:
Tender Notice
Tender Description:
Purchase of dicing cutter from Semiconductor Specialization University Support Project Group
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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