This tender is from the country of Korea in Asian region. The tender was published by Korea National University of Engineering Industry-Academic Cooperation Foundation on 12 Jun 2026 for (Re-Announcement) Wafer Inspection System Software. The last date to submit your bid for this tender is 18 Jun 2026. This tender is for the companies specializing in Scanner software package, Image-processing software package, Drivers and system software package, Debugging software package, Image-processing software development services and similar sectors. Tender Impulse ID: 13326338.
Tender Organisation:
Korea National University of Engineering Industry-Academic Cooperation Foundation
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
48318000 : Scanner software package
48328000 : Image-processing software package
48960000 : Drivers and system software package
48987000 : Debugging software package
72212328 : Image-processing software development services
Tender Document Type:
Tender Notice
Tender Description:
(Re-Announcement) Wafer Inspection System Software
Tender Bidding Type:
Tender Notice No:
Tender Document:
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