Poland – Research and measurement machines and equipment – Delivery of a device for grinding and polishing semiconductor wafers
This tender is from the country of Poland in Europe region. The tender was published by Łukasiewicz Research Network - Institute of Microelectronics and Photonics on 24 Oct 2025 for Poland – Research and measurement machines and equipment – Delivery of a device for grinding and polishing semiconductor wafers. The last date to submit your bid for this tender was 24 Nov 2025. This tender is for the companies specializing in Industrial machinery, Grinding machines, Industrial machinery and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
Łukasiewicz Research Network - Institute of Microelectronics and Photonics
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
42000000 : Industrial machinery
43414000 : Grinding machines
51541201 : Industrial machinery
Tender Document Type:
Tender Notice
Tender Description:
Poland – Research and measurement machines and equipment – Delivery of a device for grinding and polishing semiconductor wafers
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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