High-speed cumulative collapse photodiode epitaxy chip (including testing)
This tender is from the country of Taiwan in Asian region. The tender was published by national central university on 24 Feb 2026 for High-speed cumulative collapse photodiode epitaxy chip (including testing). The last date to submit your bid for this tender is 03 Mar 2026. This tender is for the companies specializing in Printed circuits, Transistor chips and similar sectors.
Tender Organisation:
national central university
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
31712300 : Printed circuits
31712354 : Transistor chips
Tender Document Type:
Tender Notice
Tender Description:
High-speed cumulative collapse photodiode epitaxy chip (including testing)
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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