Supply Delivery and Installation of Sinter Bonding Capability
This tender is from the country of United Kingdom in Europe region. The tender was published by University of Strathclyde on 19 Dec 2025 for Supply Delivery and Installation of Sinter Bonding CapabilityNational Manufacturing Institute Scotland NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors To support this expansion NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements A solution is required to form sintered bonds between dies on substrates in multi-die packages with different component heights substrates on heat sinks clips spacers and interconnection parts double-sided cooling packages. The last date to submit your bid for this tender is 26 Jan 2026. This tender is for the companies specializing in Semiconductors and similar sectors.
Tender Organisation:
University of Strathclyde
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
31712330 : Semiconductors
Tender Document Type:
Tender Notice
Tender Description:
Supply Delivery and Installation of Sinter Bonding CapabilityNational Manufacturing Institute Scotland NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors To support this expansion NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements A solution is required to form sintered bonds between dies on substrates in multi-die packages with different component heights substrates on heat sinks clips spacers and interconnection parts double-sided cooling packages
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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