AEGIS Circuit Card Assembly and FPGA Components
This tender is from the country of USA in Americas region. The tender was published by DEPT OF DEFENSE on 24 May 2025 for AEGIS Circuit Card Assembly and FPGA Components. The last date to submit your bid for this tender was 06 Jun 2025. This tender is for the companies specializing in Motherboards, Cards containing integrated circuits, Integrated circuit packages and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
DEPT OF DEFENSE
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
30237140 : Motherboards
31712113 : Cards containing integrated circuits
31712117 : Integrated circuit packages
Tender Document Type:
Tender Notice
Tender Description:
AEGIS Circuit Card Assembly and FPGA Components
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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