Procurement of equipment and materials to serve the task of Research on manufacturing new generation photo chips on glass substrates and integrating advanced chiplet packaging - 13330359
This tender with tender notice no. IB2600277688-00 is from the country of Vietnam in Asian region, details sourced from MUASAMCONG. The tender was published by High Technology and Innovation Park on 12 Jun 2026 for Procurement of equipment and materials to serve the task of Research on manufacturing new generation photo chips on glass substrates and integrating advanced chiplet packaging. The last date to submit your bid for this tender was 20 Jun 2026. Estimated budget for this tender is 3055650000.0. This tender is for the companies specializing in Electronic equipment, Microelectronic machinery and apparatus and microsystems, Integrated electronic circuits, Transistor chips and similar sectors. Tender Impulse ID: 13330359.
*The deadline for this tender has passed.
Tender Notice No:
IB2600277688-00
Tender Organisation:
High Technology and Innovation Park
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
31710000 : Electronic equipment
31712000 : Microelectronic machinery and apparatus and microsystems
31712114 : Integrated electronic circuits
31712354 : Transistor chips
Tender Source:
MUASAMCONG
Estimated Budget:
3055650000.0
Tender Document Type:
Tender Notice
Tender Description:
Procurement of equipment and materials to serve the task of Research on manufacturing new generation photo chips on glass substrates and integrating advanced chiplet packaging
Tender Bidding Type:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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