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14207597Integrated Circuit and Electronic Component Failure Detection Public Service Center (Phase II) - Integrated Circuit Sub-project (CQS26A02182) Winning Bid (Transaction) Result AnnouCountry: ChinaDeadline25 Aug 202614130177Announcement of winning bid for thermal resistance tester procurement from the School of Integrated Circuit Science and Engineering (College of Integrated Industry and Education) oCountry: ChinaDeadline20 Aug 20268707290Germany Integrated circuit packages Niederspannungsverteilungen in Ortsnetzstationen NSV-ONSCountry: GermanyDeadline31 Mar 202713921076Delivery of the Altera 5CEFA9F23I7SC FBGA-484 integrated circuit for the Military Institute of Communications - National Research InstituteCountry: PolandDeadline19 Aug 202614072612Yunnan Province Qujing Applied Technology School Integrated Circuit and Digital Hardware System Design Comprehensive Training Room Project (Package 2: Electronic Information DroneCountry: ChinaDeadline18 Aug 202614087390Public Tender Announcement for the Special Integrated Circuit Technology and Processing Procurement Project of the Institute of High Energy Physics, Chinese Academy of SciencesCountry: ChinaDeadline19 Aug 202614130320Nanjing University of Posts and Telecommunications School of Integrated Circuit Science and Engineering (College of Integration of Industry and Education) Reliability PreprocessingCountry: ChinaDeadline20 Aug 202614165775Announcement on the termination of a batch of integrated circuit design EDA and other software purchased by the Huazhong University of Science and Technology platformCountry: ChinaDeadline24 Aug 202614180275Huazhong University of Science and Technology platform purchases a batch (second) public bidding announcement for integrated circuit design EDA and other softwareCountry: ChinaDeadline24 Aug 202614181137Integrated Circuit Core Engineering Center Construction Project Tender AnnouncementCountry: ChinaDeadline24 Aug 202614216764Competitive consultation on Zhejiang University’s photonic integrated circuit chip tape-out processing servicesCountry: ChinaDeadline26 Aug 202614217758Public bidding announcement for the procurement of wafer thinning machines from the School of Integrated Circuit Science and Engineering (Industrial and Educational Integration SchCountry: ChinaDeadline26 Aug 202614254472MULTI-BAND DUAL-BEAM C-TO-Q V SATCOM ANALOGUE BEAMFORMING INTEGRATED CIRCUIT ARTES AT 7B 091 - EXPROCountry: FranceDeadline02 Oct 202614256435Announcement of Winning Bid for the Integrated Circuit Chip Tape-out Service Procurement Project of the University of Electronic Science and Technology of ChinaCountry: ChinaDeadline27 Aug 202614256670Shaanxi Vocational and Technical College Industry-Education Integration Training Base Project-Intelligent Hardware and Integrated Circuit Innovation Center-Industrial Detection SysCountry: ChinaDeadline27 Aug 202614260949Announcement of Public Bidding and Procurement of Practical Training Equipment for Electrical Engineering and Integrated Circuit Process Manufacturing of Taiyuan University of TechCountry: ChinaDeadline27 Aug 2026
