3d packaging system for high-frequency components
This tender is from the country of Germany in Europe region. The tender was published by Friedrich Schiller University Jena on 21 Jan 2026 for 3d packaging system for high-frequency components. The last date to submit your bid for this tender is 10 Feb 2026. This tender is for the companies specializing in Paper or envelope folding machines, Packaging machines and similar sectors.
Tender Organisation:
Friedrich Schiller University Jena
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
30131100 : Paper or envelope folding machines
42921320 : Packaging machines
Tender Document Type:
Tender Notice
Tender Description:
3d packaging system for high-frequency components
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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