Buy flip chip bonder
This tender is from the country of Korea in Asian region. The tender was published by Korea Institute of Science and Technology on 13 Jan 2026 for Buy flip chip bonder. The last date to submit your bid for this tender is 03 Feb 2026. This tender is for the companies specializing in Staples, tacks, drawing pins, Transistor chips, Repair of microcomputers and similar sectors.
Tender Organisation:
Korea Institute of Science and Technology
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
30197100 : Staples, tacks, drawing pins
31712354 : Transistor chips
50312420 : Repair of microcomputers
Tender Document Type:
Tender Notice
Tender Description:
Buy flip chip bonder
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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