Provision of One (1) Unit of Fully Automated Die-to-Wafer Surface Preparation Equipment and/or Die-to-Wafer Bonder
This tender is from the country of Singapore in Asian region. The tender was published by Agency for Science, Technology and Research on 13 May 2025 for Provision of One (1) Unit of Fully Automated Die-to-Wafer Surface Preparation Equipment and/or Die-to-Wafer Bonder. The last date to submit your bid for this tender was 06 Jun 2025. This tender is for the companies specializing in Dry-etching equipment, Industrial kitchen equipment, Soldering equipment and similar sectors.
*The deadline for this tender has passed.
Tender Organisation:
Agency for Science, Technology and Research
Tender Sector:
Tender Service:
Worldwide
Tender Region:
Tender Country:
Tender CPV:
22520000 : Dry-etching equipment
39314000 : Industrial kitchen equipment
42661100 : Soldering equipment
Tender Document Type:
Tender Notice
Tender Description:
Provision of One (1) Unit of Fully Automated Die-to-Wafer Surface Preparation Equipment and/or Die-to-Wafer Bonder
Tender Bidding Type:
Tender Notice No:
Tender Document:
- 1 week to go
- 15 Days to go
- More than 15 days to go
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